PCB Assembly
SMD and THT assembly on state-of-the-art production lines – from prototype to high-volume series.
PCB assembly is the heart of our EMS manufacturing. With state-of-the-art SMD placement machines and THT soldering systems, we manufacture your electronics in the highest quality. Whether individual prototypes for development validation or series production with several thousand units per month – our production lines are flexibly configurable and optimized for quick changeovers.
SMD Assembly
- High-precision placement with modern pick-and-place machines (down to 01005 / 0.4 mm pitch)
- Processing of all common SMD packages: Chip, QFN, BGA, LGA, SOP, MELF
- Full optical inspection (AOI) after each placement step
- Suitable for single units, small and large series – flexibly configurable
THT Assembly & Wave Soldering
- Manual and semi-automated assembly of through-hole components
- Wave soldering for conventional through-hole mounting in high volumes
- Selective flux application for reproducible soldering results
- Processing of connectors, transformers, heat sinks and special housings
Selective Soldering for Mixed Technology
- Combined SMD/THT assembly on one PCB without compromise
- Selective soldering protects temperature-sensitive SMD components from wave heat
- Programmable solder joints for reproducible single-point soldering
- Ideal for power electronics with high component density and mixed assembly
Reflow Soldering (leaded & lead-free)
- Precise temperature profiling for lead-free (SAC305) and leaded solders
- Multi-zone reflow ovens for uniform heat distribution on large assemblies
- Profile optimization for heat-sensitive components and high-thermal-mass boards
- Documented soldering profiles for reproducibility in series production
Vapor Phase Soldering for Power Electronics
- Gentle and uniform heat transfer through condensation heat
- Ideal for power modules, SiC/GaN components and high thermal masses
- Prevents overheating – maximum temperature physically limited by the fluid
- Low warpage and reliable soldering results even with complex assemblies
Paste Printing with SPI Control
- Precise solder paste printing with automatic stencil printer
- 100% inspection of paste application through Solder Paste Inspection (SPI) after printing
- Stencil optimization for fine-pitch and high-density layouts
- Complete documentation of print parameters for quality traceability
Fast Prototype Production
- Express assembly from single units – turnaround in 24–72 hours possible
- Direct line between development and production for quick feedback
- Prototypes with series-identical process for valid development results
- Support with material provision and component procurement for individual samples
Flexible Lot Sizes
- Production from single units to several thousand per month on the same lines
- Quick changeovers through standardized production preparation
- No minimum order value – economical even for small series and follow-ups
- Scalable capacity planning for growing series volumes
NPI Process (New Product Introduction)
- Structured introduction process for new products from prototype to series
- First article inspection report (EMPB/PPAP-like) for series release
- DFM/DFT review before series start – manufacturability and testability ensured
- Close coordination between development, purchasing and production planning
Clarify feasibility – before costs arise.
Send us your requirements. We evaluate feasibility, risks and timeline – and tell you honestly what works.
Request PCB Assembly Quote