Module Assembly

Potting (PU, Epoxy, Silicone)

• Protection of sensitive assemblies against moisture, vibration, chemical influences and mechanical stress
• Potting material selection based on thermal, dielectric and application-specific requirements
• PU for flexible applications, epoxy for maximum hardness and chemical resistance
• Process-safe processing with defined curing parameters and visual inspection per IPC standards

Conformal Coating

• Selective or full-area coating for protection against corrosion, moisture, dust and creepage currents
• Material selection by requirement: acrylic, polyurethane, epoxy or UV-curing coatings
• Application by spraying, dipping or selective dispensing – depending on assembly and protection class
• UV fluorescence inspection for 100 % coating coverage and uniformity verification

Cable Assembly & Wire Harnesses

• Custom cable and wire harness manufacturing per schematic or sample – single unit to series production
• Crimping, soldering, pressing and assembly of all common connector systems (TE, Molex, JST, Deutsch and more)
• Electrical testing of every wire harness for continuity, insulation and correct pin assignment
• Labeling per customer specification – ferrules, heat shrink, cable ties and strain relief

Housing Assembly & Final Assembly

• Complete assembly of electronic modules into customer housings – from PCB to ready-to-ship device
• Mechanical processing, screwing, bonding, potting and sealing within a single production line
• Assembly instructions per customer specifications – reproducible and documented
• Functional test of the finished unit before shipping – optionally with customer acceptance protocol

Press-Fit Technology

• Solder-free, gas-tight press-fit contacts for highest reliability in vibration environments and temperature fluctuations
• Suitable for connectors, power terminals and bus connections with high current-carrying capacities
• Controlled press-in process with defined verification of correct press-in depth
• Particularly suitable for automotive and industrial applications requiring long-term stable electrical connections

Thermal Paste & Thermal Interface Materials

• Professional application of thermal pastes, pads and phase-change materials on power components and heat sinks
• Material selection based on thermal conductivity, compression behavior, long-term stability and processability
• Defined layer thickness for reproducible thermal resistance – critical for lifetime and thermal performance
• Documented process as basis for thermal simulation and certification documentation

Laser Marking & Labeling

• Permanent, tamper-proof marking of assemblies, housings and individual parts via laser marking
• Serial numbers, QR codes, data matrix, logos and plain text – readable by humans and machines
• Traceability from individual part to batch – direct connection to manufacturing database possible
• No ink, no wear, no solvents – resistant to cleaning agents, oils and UV radiation

Packaging & Shipping Logistics

• ESD-compliant packaging of sensitive electronic assemblies per ANSI/ESD S20.20 and customer specifications
• Individual packaging concepts: blister, foam inlay, cardboard, mesh boxes – depending on quantity and sensitivity
• Labeling, delivery note documentation and shipping preparation as integrated production completion
• Direct delivery to end customers or warehouse integration – seamlessly integrated into your logistics chain

Workstation-Specific Assembly Instructions

• Creation of visual, step-by-step assembly instructions for each production workstation – clear, unambiguous, image-supported
• Digital or printed provision directly at the workstation – multilingual on request
• Versioned documents with change history – every product revision is traceably documented
• Basis for onboarding new employees and auditability within ISO 9001 and customer audits