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Electronics Development

Hard & Software Design

From system architecture through circuit design and PCB layout to embedded firmware.

Hard & Software Design
Hard & Software Design

CME develops hardware and software as an integrated unit. Our engineers work closely together from system specification through circuit design and PCB layout to embedded firmware. Through close integration with our own manufacturing, DfM requirements flow into the development phase early – saving time and costs in series transition.

System Architecture & Requirements Management

  • Analysis and structuring of technical requirements (specifications)
  • Definition of system architectures for embedded control systems
  • Interface management between HW, SW and mechanics
  • Risk analysis and feasibility assessment in early phases

Analog & Digital Circuit Design

  • Circuit design for sensor, signal and control loops
  • Mixed-signal designs with microcontrollers, FPGAs and DSPs
  • EMC-compliant circuit design per IEC standards
  • Simulation and verification before the first prototype

Power Electronics (SiC, GaN, IGBT)

  • Development of DC/DC converters, inverters and rectifiers
  • Use of wide-bandgap semiconductors (SiC, GaN) for maximum efficiency
  • Thermal management and cooling concepts
  • Qualification for high-current and high-voltage applications

Drive Electronics & Motor Control

  • BLDC, PMSM and stepper motor control
  • FOC (Field Oriented Control) and sensorless control methods
  • Development of custom inverters and motor controllers
  • Integration into automation and mobility applications

Multi-Layer PCB Layout

  • 2 to 16-layer PCBs incl. HDI and blind/buried vias
  • DFM-compliant layout with direct link to in-house manufacturing
  • Impedance-controlled routing and signal integrity analysis
  • Design rule check (DRC) and thermal simulation

Embedded C/C++ Firmware

  • Bare-metal and RTOS-based firmware for ARM Cortex, PIC, AVR, Infineon, STM, Renesas, …
  • Driver and BSP development for custom hardware
  • Bootloader, OTA updates and secure firmware architectures
  • Debugging, profiling and hardware-in-the-loop testing

Communication Interfaces (CAN, LIN, SPI, Ethernet)

  • Implementation of CAN, CAN-FD, LIN, Modbus, Profibus
  • Ethernet-based protocols: EtherCAT, Profinet, TCP/IP
  • Wireless connectivity: Bluetooth, WLAN, cellular (IoT-ready)
  • Protocol stack integration and system tests under real conditions

Functional Safety (ISO 26262)

  • Development per ISO 26262 (automotive) and IEC 62061 (industrial)
  • FMEA, FMEDA, FTA – systematic safety analyses
  • Design and verification of safety-relevant circuits (ASIL B–D)
  • Documentation and evidence management for approval processes

Assembly & Interconnection Technology (Ceramic, IMS, Leadframe, Bare-Die)

  • Development of assemblies based on copper inlays, IMS substrates and ceramic carriers for high thermal loads
  • Development of bare-die mounting and wire bonding for compact high-performance modules in close coordination with the manufacturer
  • Leadframe designs for industrial and automotive package concepts
  • Close coordination between development and manufacturing (DFM)

Expert Knowledge

Where others stop, we start.

Our engineers have years of experience with electronics under extreme operating conditions – high temperatures, high currents, strong vibrations.

>150 °CAmbient Temperature

Design of electronics modules for extreme ambient temperatures – e.g. motor-mounted power electronics or industrial furnaces.

>300 ACircuit Design

High-current designs for drive inverters, charging technology and industrial power supplies – optimized busbars, copper inlays and assembly technology for continuous currents beyond 300 A.

>20 gVibration Load

Robust electronics for extreme mechanical loads – automotive, rail, industrial robots and mobile machinery.

Embedded Software

Software that performs on the target system.

We develop embedded software optimally tailored to the hardware and customer requirements – from simple controls to highly complex, safety-relevant applications with the most demanding documentation and quality criteria.

Services

ISO 15504 / SPICE-compliant development

Requirements analysis & SW specification

Coding in C, C++ and assembler

MISRA compliance, static code analysis & runtime analysis

SW module, function & integration testing

Safety-relevant SW development (IEC 61508 / ISO 26262)

Development Focus Areas

Drive & control methods for BLDC, PSM, SR & DC motors

Drive controls (torque, speed, position)

Sensorless & sensor-based control concepts

Communication modules (CAN, LIN, PWM, SENT, SPI, I²C)

Maximum utilization of MCU resources for cost-optimal system solutions

Optimization of low-cost drive systems

Clarify feasibility – before costs arise.

Send us your requirements. We evaluate feasibility, risks and timeline – and tell you honestly what works.

Send requirements