Hard & Software Design
From system architecture through circuit design and PCB layout to embedded firmware.
CME develops hardware and software as an integrated unit. Our engineers work closely together from system specification through circuit design and PCB layout to embedded firmware. Through close integration with our own manufacturing, DfM requirements flow into the development phase early – saving time and costs in series transition.
System Architecture & Requirements Management
- Analysis and structuring of technical requirements (specifications)
- Definition of system architectures for embedded control systems
- Interface management between HW, SW and mechanics
- Risk analysis and feasibility assessment in early phases
Analog & Digital Circuit Design
- Circuit design for sensor, signal and control loops
- Mixed-signal designs with microcontrollers, FPGAs and DSPs
- EMC-compliant circuit design per IEC standards
- Simulation and verification before the first prototype
Power Electronics (SiC, GaN, IGBT)
- Development of DC/DC converters, inverters and rectifiers
- Use of wide-bandgap semiconductors (SiC, GaN) for maximum efficiency
- Thermal management and cooling concepts
- Qualification for high-current and high-voltage applications
Drive Electronics & Motor Control
- BLDC, PMSM and stepper motor control
- FOC (Field Oriented Control) and sensorless control methods
- Development of custom inverters and motor controllers
- Integration into automation and mobility applications
Multi-Layer PCB Layout
- 2 to 16-layer PCBs incl. HDI and blind/buried vias
- DFM-compliant layout with direct link to in-house manufacturing
- Impedance-controlled routing and signal integrity analysis
- Design rule check (DRC) and thermal simulation
Embedded C/C++ Firmware
- Bare-metal and RTOS-based firmware for ARM Cortex, PIC, AVR, Infineon, STM, Renesas, …
- Driver and BSP development for custom hardware
- Bootloader, OTA updates and secure firmware architectures
- Debugging, profiling and hardware-in-the-loop testing
Communication Interfaces (CAN, LIN, SPI, Ethernet, LoRaWAN, Zigbee)
- Implementation of CAN, CAN-FD, LIN, Modbus, Profibus
- Ethernet-based protocols: EtherCAT, Profinet, TCP/IP
- Wireless connectivity: Bluetooth, WLAN, cellular (IoT-ready)
- LPWAN radio interfaces: LoRaWAN for long-range IoT, Zigbee for mesh networks in building and industrial automation
- Antenna design coordination, RF layout and certification support (RED, FCC)
- Protocol stack integration and system tests under real conditions
Functional Safety (ISO 26262)
- Development per ISO 26262 (automotive) and IEC 62061 (industrial)
- FMEA, FMEDA, FTA – systematic safety analyses
- Design and verification of safety-relevant circuits (ASIL B–D)
- Documentation and evidence management for approval processes
Assembly & Interconnection Technology (Ceramic, IMS, Leadframe, Bare-Die)
- Bare-die design: chip-on-board (CoB), flip-chip and wire bonding for compact high-performance modules – from semiconductor selection to process coordination with the manufacturer
- Ceramic substrates: circuit development on Al₂O₃, AlN and Si₃N₄ ceramics for highest thermal demands and insulation strength
- IMS and copper inlay designs for optimized heat dissipation with power semiconductors
- Leadframe designs for industrial and automotive package concepts
- Extensive experience in coordinating bare-die layout, bonding process and substrate selection – DFM-optimized
Expert Knowledge
Where others stop, we start.
Our engineers have years of experience with electronics under extreme operating conditions – high temperatures, high currents, strong vibrations.
Design of electronics modules for extreme ambient temperatures – e.g. motor-mounted power electronics or industrial furnaces.
High-current designs for drive inverters, charging technology and industrial power supplies – optimized busbars, copper inlays and assembly technology for continuous currents beyond 300 A.
Robust electronics for extreme mechanical loads – automotive, rail, industrial robots and mobile machinery.
Embedded Software
Software that performs on the target system.
We develop embedded software optimally tailored to the hardware and customer requirements – from simple controls to highly complex, safety-relevant applications with the most demanding documentation and quality criteria.
Services
ISO 15504 / SPICE-compliant development
Requirements analysis & SW specification
Coding in C, C++ and assembler
MISRA compliance, static code analysis & runtime analysis
SW module, function & integration testing
Safety-relevant SW development (IEC 61508 / ISO 26262)
Development Focus Areas
Drive & control methods for BLDC, PSM, SR & DC motors
Drive controls (torque, speed, position)
Sensorless & sensor-based control concepts
Communication modules (CAN, LIN, PWM, SENT, SPI, I²C)
Maximum utilization of MCU resources for cost-optimal system solutions
Optimization of low-cost drive systems
Clarify feasibility – before costs arise.
Send us your requirements. We evaluate feasibility, risks and timeline – and tell you honestly what works.
Send requirements